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バリスタ
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種類
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バリスタ
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特徴
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．反応が速くて、効率的に突入電流を処理する
．漏洩電流が低い。電圧を抑える特性と安定的な執行力がある
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用途
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．IC、ダイオード、トランジスター、夾流體、遮蔽効果があった半導体、及びそのほかの半導体などの電子部品を保護する。
．消費類と工業用の電子製品の内部に主電流が瞬間に発生した突入電流を抑える
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外観図
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L:20mm min
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SIZE
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D
max.
|
H
max.
|
d
±0.05
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E
±0.8
|
|
D05
|
7
|
10
|
0.6
|
5
|
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D07
|
9
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12
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0.6
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5
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D09
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11
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14
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0.6
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5
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D10
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13
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16
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0.8
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7.5
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D14
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17
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20
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0.8
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7.5
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D18
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22
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25
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0.8
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7.5
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D20
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25
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28
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0.8
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7.5
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1.0
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10
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|
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厚度
單位：mm
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|
Prat Code
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D05
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D07
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D09
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D10
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D14
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D18
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D20
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182K
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|
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12.5
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12.5
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12.5
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15.6
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152K
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|
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11
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11
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11
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13.2
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112K
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7.5
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8.5
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8.5
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8.5
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10.1
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102K
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7.3
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8.3
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8.3
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8.3
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9.5
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911K
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7.1
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8.1
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8.1
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8.1
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9.0
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821K
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6.9
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6.9
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7.9
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7.9
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7.9
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8.5
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781K
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6.7
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6.7
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7.7
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7.7
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7.7
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8.4
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751K
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6.5
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6.5
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6.5
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7.5
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7.5
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7.5
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8.2
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681K
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6.4
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6.4
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6.4
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7.1
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7.1
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7.1
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7.8
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621K
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6.4
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6.4
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6.4
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7.1
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7.1
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7.1
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7.5
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561K
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6.2
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6.2
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6.2
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6.7
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6.7
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6.7
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7.0
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511K
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5.8
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5.8
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5.8
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6.4
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6.4
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6.4
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6.8
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471K
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5.6
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5.6
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5.6
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6.1
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6.1
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6.1
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6.6
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431K
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5.3
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5.3
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5.3
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5.9
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5.9
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5.9
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6.4
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391K
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5.1
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5.1
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5.1
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5.7
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5.7
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5.7
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6.2
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361K
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5.0
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5.0
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5.0
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5.5
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5.5
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5.5
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6.2
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331K
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4.8
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4.8
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4.8
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5.3
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5.3
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5.3
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5.9
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301K
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4.7
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4.7
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4.7
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5.1
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5.1
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5.1
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5.7
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271K
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4.5
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4.5
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4.5
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5.0
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5.0
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5.0
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5.6
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包裝
規格
單位:mm
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Symbol
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Series
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Parameter
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05D
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07D
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09D
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10D
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14D
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18D
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20D
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P
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Pitch of Component
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12.7±1.0
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12.7±1.0
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12.7±1.0
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15.0±1.0
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25.4±1.0
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25.4±1.0
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25.4±1.0
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P0
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Feed hole Center to Lead
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12.7±0.3
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12.7±0.3
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12.7±0.3
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15.0±0.3
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25.4±0.3
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25.4±1.0
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25.4±1.0
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P1
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Feed Hole Center to Lead
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3.85±0.7
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3.85±0.7
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3.85±0.7
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3.75±0.7
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8.95±0.7
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7.7±0.7
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7.7±0.7
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P2
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Hole Center to Component Center
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6.35±1.3
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6.35±1.3
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6.35±1.3
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7.5±1.3
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12.7±1.3
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12.7±1.3
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12.7±1.3
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F
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Lead to Lead Distance
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5.0±0.8
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5.0±0.8
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5.0±0.8
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7.5±0.8
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7.5±0.8
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10.0±0.8
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10.0±0.8
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△h
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Component Alignment
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0±2
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0±2
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0±2
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0±2
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0±4
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0±4
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0±4
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W
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Tape Width
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18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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W0
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Hold Down Tape Width
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12.5max
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12.5max
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12.5max
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12.5max
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12.5max
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12.5max
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12.5max
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W1
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Hold Position
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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W2
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Hole Down Tape Position
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3.0max
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3.0max
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3.0max
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3.0max
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3.0max
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3.0max
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3.0max
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H
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Height from Center to Component
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20.0±2.0
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20.0±2.0
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20.0±2.0
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20.0±2.0
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20.0±2.0
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20.0±2.0
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20.0±2.0
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1
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Length of Clipped Lead
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1.0max
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1.0max
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1.0max
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1.0max
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1.0max
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1.0max
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1.0max
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D0
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Feed Hole Diameter
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4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
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t
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Total Tape Thickness
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0.6±0.3
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0.6±0.3
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0.6±0.3
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0.6±0.3
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0.6±0.3
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0.6±0.3
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0.6±0.3
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Symbol
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Series
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Parameter
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05D
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07D
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09D
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10D
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14D
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18D
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20D
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P
|
Pitch of Component
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12.7±1.0
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12.7±1.0
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12.7±1.0
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15.0±1.0
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25.4±1.0
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25.4±1.0
|
25.4±1.0
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P0
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Feed hole Center to Lead
|
12.7±0.3
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12.7±0.3
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12.7±0.3
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15.0±0.3
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25.4±0.3
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25.4±1.0
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25.4±1.0
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P1
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FeedHoleCenter to Lead
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3.85±0.7
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3.85±0.7
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3.85±0.7
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3.75±0.7
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8.95±0.7
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7.7±0.7
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7.7±0.7
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P2
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HoleCenter to ComponentCenter
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6.35±1.3
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6.35±1.3
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6.35±1.3
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7.5±1.3
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12.7±1.3
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12.7±1.3
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12.7±1.3
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F
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Lead to Lead Distance
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5.0±0.8
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5.0±0.8
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5.0±0.8
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7.5±0.8
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7.5±0.8
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10.0±0.8
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10.0±0.8
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△h
|
Component Alignment
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0±2
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0±2
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0±2
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0±2
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0±4
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0±4
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0±4
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W
|
Tape Width
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18.0±1.0
|
18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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18.0±1.0
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W0
|
Hold Down Tape Width
|
12.5max
|
12.5max
|
12.5max
|
12.5max
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12.5max
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12.5max
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12.5max
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W1
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Hold Position
|
9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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9.0±0.5
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W2
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Hole Down Tape Position
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3.0max
|
3.0max
|
3.0max
|
3.0max
|
3.0max
|
3.0max
|
3.0max
|
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H
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Height from TapeCenter to Component
|
20.0±2.0
|
20.0±2.0
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20.0±2.0
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20.0±2.0
|
20.0±2.0
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20.0±2.0
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20.0±2.0
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|
1
|
Length of Clipped Lead
|
1.0max
|
1.0max
|
1.0max
|
1.0max
|
1.0max
|
1.0max
|
1.0max
|
|
D0
|
Feed Hole Diameter
|
4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
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4.0±0.2
|
4.0±0.2
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t
|
Total Tape Thickness
|
0.6±0.3
|
0.6±0.3
|
0.6±0.3
|
0.6±0.3
|
0.6±0.3
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0.6±0.3
|
0.6±0.3
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小さなマップをクリックして 地図を拡大表示できます
TEL : 886-3-3680909
FAX : 886-3-3731717
Add :桃園市八徳区瑞源街88號
E-mail : sales@chengtung.com.tw
連絡人 : 沈銀鳳／彭淳欣／蘇逸凱／劉燕
